As the originator of the precision processing techniques of lapping and polishing ceramic substrates and metals for optimal circuit performance, Accumet is continuing our leadership in the field by investing in the latest procedures and equipment. We are, and will continue to be, the most advanced service provider to the mil/aero industry of prepared materials for your high-performance microelectronics.
Building [...] Read More
Accumet is pleased to announce their attendance at the 2018 International Microwave Symposium in Philadelphia, PA, June 10th through 15th. Representatives from Accumet will be speaking with attendees about the benefits of working with a Lapping and Polishing shop that stocks their own materials at booth 1719.
Representatives from their sister company, Laser Services, will also [...] Read More
Typically, the end application and technology requirements dictate the optimal surface finish and thickness tolerance. If the application requires a surface finish greater than what can be achieved with grinding, the next steps are lapping then polishing (if needed). Common applications where the additional precision of the surface finish and thickness are more critical are high frequency RF and microwave, [...] Read More
Grinding, lapping, and polishing are machining techniques that refine a substrate to exact dimensions and tolerances for optimal circuit metallization during both thick and thin film technology procedures. Because the “as-fired”, or as delivered, condition of ceramic, fused silica, or titanate substrates are most often imperfect (wavy, pitted, bumpy, varied in thickness), one or more of [...] Read More