Diamond Cutting and Scribing Services

Diamond scribing and dicing is a precision method for subdividing ceramic and other substrate materials — typically after patterning or plating — into individual components. It is used in microelectronics, RF/microwave, aerospace, and semiconductor manufacturing where clean, accurate cuts or scribed lines are needed. The process uses diamond blades of assorted widths to scribe, dice, saw, or produce bevels and chamfers on a wide variety of substrate materials.

Diamond cutting can process parts up to 0.150" thick, with geometries as small as 0.005" × 0.005". Accuracy can be held to ±0.0003", with repeatability within 0.0001". Edge chamfers and bevels can be held within 0.0005" on virtually all ceramic materials using a wide variety of diamond wheels.

Accumet offers automated, computerized diamond scribing and dicing as a fast and economical method for subdividing patterned or fully plated substrate materials. Parts up to 0.150" thick can be processed in geometries as small as 0.005" × 0.005", with accuracy to ±0.0003" and repeatability within 0.0001". Accumet also provides diamond sawing with machined edges, bevels, and chamfers held within 0.0005" on virtually all ceramic materials, using assorted blade widths.

Diamond scribing creates a controlled crack line in the substrate that is then broken along that line, producing singulated parts without removing material as kerf. Diamond dicing uses a blade to cut fully through the material, removing a small amount as kerf. Scribing is typically preferred when minimizing material loss is important or when the substrate is thin and fragile. Dicing is preferred when part geometry requires fully cut edges or when edge quality and dimensional control take priority.

Accumet's diamond cutting and scribing service uses state-of-the-art automated, computerized equipment that holds accuracy to ±0.0003" and repeatability within 0.0001". A wide variety of diamond wheels enables smooth edges and chamfers within 0.0005" across virtually all ceramic materials. AS9100 and ISO 9001 certifications govern process controls, traceability, and quality documentation across all production runs.

Diamond scribing and dicing is a mechanical process well-suited for straight-line subdivision of patterned or plated ceramics after processing, holding accuracy to ±0.0003" with controlled edge quality. Laser cutting is a non-contact process that uses thermal energy and is better suited for intricate geometries, small features, through-holes, or materials where mechanical stress would cause cracking or yield loss. Diamond scribing is generally preferred for post-process singulation of flat, patterned substrates; laser cutting is preferred when complex contours, micro-features, or heat-affected zone control are the priority.