Tech Brief Describes Laser Ablation as The Alternative to Chemical Etching and Solder Dams

Laser ablation is a process that product manufacturers may wish to consider when looking to remove unwanted materials from a part’s surface or when they wish to control solder flow on a PCB — typically so excess solder does not travel where it’s not supposed to and cause electrical shorting. For cleaning a surface the technology that laser ablation typically replaces is chemical milling. For controlling solder flow, the replaced technology is typically solder dams.

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