Tech Brief Describes Fabrication Choices for Power Electronic Performance and Yield
Posted on February 8, 2019 in Tech Briefs
Many solid-state power electronics, including those used in high-powered LED, RF/Microwave, electric vehicle, train and rail, electrical infrastructures, and military applications rely on physically and thermally robust ceramic materials as a base. These ceramic materials are bonded to thermally and electrically conductive metals to help transfer thermal energy to heat spreaders/ heat sinks and away from the critical device or component active areas, while electrically insulating the power electronics from grounded shielding and enclosures.
Due to the diversity of solid-state power electronic devices and components, as well as the applications, there is a wide range of substrate fabrication technologies and pre-processing that can be done. Choosing among the various options and prefab processing stages necessary to prepare a ceramic material, or substrate, for fabrication can be a challenge in and of itself.
This technical brief includes a discussion of several of the most common power electronic substrate fabrication methods and associated prefabrication processing steps essential to meeting high-power electronic performance requirements for a wide range of applications. Further insights regarding the impact that ceramic material choices have with each substrate fabrication process are also detailed.
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