Tech Brief Describes the Process of Lapping and Polishing Ceramic Substrates

Posted on Tuesday, July 17, 2018

Lapping, polishing, and grinding are machining techniques that refine a substrate to exact dimensions and tolerances for optimal circuit metallization during both thick and thin film technology procedures. Because the “as-fired”, or as delivered, condition of ceramic, fused silica, or titanate substrates are most often imperfect (wavy, pitted, bumpy, varied in thickness), one or more of these processes is employed to create the exact parallelism, camber, thickness, and surface finish needed. 

To learn more about this process, download our tech brief "A Pre-metallization Guide to Lapping and Polishing Ceramic Substrates" >>

 

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