Tech Briefs

Each method has its relative pluses and minuses and no one method fits every situation. The thickness of the stock to be cut, hardness of the stock, whether or not the stock is stacked or layered, your cost and timing requirements, and the desired condition of the material after it’s been cut are among the…

With an aging global population and a surge of innovative new healthcare related technologies, it is no surprise that the medical device and tooling industry is expanding rapidly, and competition is increasing. The latest in medical tool and device designs, such as sensors, tubes, and surgical tools and devices, are now demanding levels of precision…

Choice of ceramic materials, circuit layouts, and singulation methods are key to achieving the required cost, fabrication time, size, weight, and yield of your laserprocessed microelectronics substrates. When it comes to shaping, drilling, and singulating circuit ceramic substrates, lasers offer key advantages compared to other methods, such as mechanical dicing (with a saw or die),…

When the object you wish to engrave has a circumference, the method of choice is typically rotary engraving, especially if you wish to engrave the object on more than one side. It is usually far easier to rotate the object on a spindle than it is to rotate the engraving equipment around the object. Most…

Product designers and process engineers considering laser welding as an alternative to more conventional types of welding, such as MIG/TIG arc welding, will find each has its plusses and minuses. But for many applications laser welding is a cleaner, more precise, and more controlled method of welding and is especially useful when looking to bond…