Design Guidelines: Laser Welding

Design Guideline: Laser Welding

“Laser” stands for Light Amplification by Stimulated Emission of Radiation. Simply put, laser welding uses a laser’s energy to generate heat in a focused beam. The beam is focused on a designated area, and energy is then pulsed through the beam and directed at that area. The beam causes the metal or metals to heat…

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High Precision Lapping and Polishing Design Guidelines

Lapping and Polishing Guidelines

Lapping and Polishing are processes which are performed to achieve a desired surfaced finish, thickness, parallelism and flatness of any substrate. An application may warrant highly demanding tolerances that off-the-shelf stock or “as-fired” material simply cannot achieve. Accumet has developed several unique substrate lapping machining processes that achieve extremely tight tolerances while offering repeatability from piece to piece.…

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Download our Design Guideline: Optimal Tolerances and Layouts for Laser Processing Ceramic Substrates

Download our Design Guideline: Optimal Tolerances and Layouts for Laser Processing Ceramic Substrates

When RF designers are weighing material choices and considering circuit design during prototype development, Accumet’s material and process engineers are available to help make the right decisions about optimal tolerances and layouts for laser processing ceramic substrates. You can tap into Accumet’s extensive knowledge of ceramic substrates and RF materials, circuit design, anticipated yield loss, attainable…

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