Blogs

One of the fastest and most repeatable metal cutting methods is to cut with an industrial laser. Lasers quickly make precise cuts, even when working with the smallest and most intricate pieces. By highly focusing its beam and reducing its spot size, the laser becomes a sharp cutting tool. A typical cut width of .003”…

Stainless steel is a material solution used in a wide variety of applications because of its inherent corrosion resistance, high temperature oxidation resistance, and strength. Joining separate stainless steel pieces via a high power welding process is preferred over other methods of welding or adhesion in many automotive, medical, and military and aerospace (MIL/AERO) applications…

Are you working with a ceramic substrate processing partner to prepare your materials for the final manufacturing of your integrated circuits (ICs)? It's helpful to work with a partner that will work with you during prototype development to ensure your base substrate has been fully optimized to achieve your desired outcomes regarding your IC's performance…

One of our mottos at Accumet is to “trust the weld – with data.” By this, we mean that our design teams take every necessary step to ensure a solid, repeatable weld, that will hold up to the most rigorous of environmental conditions. We have previously explained the importance of laser welded hermetic seals and…

In 1965, Intel co-founder Gordon Moore predicted, based on careful observations of emerging technological trends, the steady, two-year cadence of chip improvements that would double a processor’s performance every couple of years, while simultaneously decreasing its relative cost. While far from prophetic, “Moore’s Law”, as it came to be known, would hold true for decades,…

When plating through holes in a printed circuit board, sometimes vias are filled irregularly. The result is raised bumps along surface of board. There was a time where this was not a problem, but in the age of surface mount components, surface planarity is critical. This is because adjacent, low-profile components may be affected by…