Lapping, polishing, and grinding are machining techniques that refine a substrate to exact dimensions and tolerances for optimal circuit metallization during both thick and thin film circuit technology procedures. Because the “as-fired”, or as delivered, condition of ceramic, fused silica, or titanate substrates are most often imperfect (wavy, pitted, bumpy, varied in thickness), one or [...] Read More
We are proud to announce the release of our new tech brief! Aimed at high power circuit and system designers, the brief details the common ceramic and semiconductor material choices encountered by designers, and offers insight on the advantages, disadvantages, and tradeoffs of each so as to allow for informed decision making that leads to ideal performance and yields.
Among the choices for materials [...] Read More
Choice of ceramic materials, circuit layouts, and singulation methods are key to achieving the required cost, fabrication time, size, weight, and yield of your laserprocessed microelectronics substrates.
When it comes to shaping, drilling, and singulating circuit ceramic substrates, lasers offer key advantages compared to other methods, such as mechanical dicing (with a saw or die), water jetting, [...] Read More
Product manufacturers may wish to consider laser marking as an alternative to screen printing (also called silk screening) when looking to permanently mark a surface such as with a bar code, a serial number, a logo, or calibration settings. Depending on the application, laser marking and screen printing each have their pluses and minuses — although for most applications laser marking is faster, [...] Read More
Laser ablation is a process that product manufacturers may wish to consider when looking to remove unwanted materials from a part’s surface or when they wish to control solder flow on a PCB — typically so excess solder does not travel where it’s not supposed to and cause electrical shorting. For cleaning a surface the technology that laser ablation typically replaces is chemical milling. [...] Read More
Each method has its relative pluses and minuses and no one method fits every situation. The thickness of the stock to be cut, hardness of the stock, whether or not the stock is stacked or layered, your cost and timing requirements, and the desired condition of the material after it’s been cut are among the key factors that determine which method is right for a particular job. There are also some [...] Read More
With an aging global population and a surge of innovative new healthcare related technologies, it is no surprise that the medical device and tooling industry is expanding rapidly, and competition is increasing. The latest in medical tool and device designs, such as sensors, tubes, and surgical tools and devices, are now demanding levels of precision that are forcing manufacturers to leverage new fabrication [...] Read More
When the object you wish to engrave has a circumference, the method of choice is typically rotary engraving, especially if you wish to engrave the object on more than one side. It is usually far easier to rotate the object on a spindle than it is to rotate the engraving equipment around the object. Most rotary engraving falls into one of two broad camps. One is mechanical rotary engraving, in which [...] Read More
Product designers and process engineers considering laser welding as an alternative to more conventional types of welding, such as MIG/TIG arc welding, will find each has its plusses and minuses. But for many applications laser welding is a cleaner, more precise, and more controlled method of welding and is especially useful when looking to bond small, thin materials such as medical tools, foils, and [...] Read More