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Lapping, polishing, and grinding are machining techniques that refine a substrate to exact dimensions and tolerances for optimal circuit metallization during both thick and thin film technology procedures. Because the “asfired”, or as delivered, condition of ceramic, fused silica, or titanate substrates are most often imperfect (wavy, pitted, bumpy, varied in thickness), one or more of [...] Read More

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Copyright © 1996 - 2018 by Accumet.