Choice of ceramic materials, circuit layouts, and singulation methods are key to achieving the required cost, fabrication time, size, weight, and yield of your laserprocessed microelectronics substrates.
When it comes to shaping, drilling, and singulating circuit ceramic substrates, lasers offer key advantages compared to other methods, such as mechanical dicing (with a saw or die), water jetting, and mechanical drilling. But leveraging those advantages is not as simple as just deciding to employ a laser. Choices about how the substrate will be laser-processed and the material choice itself greatly impact circuit layout and thus fabrication time, size and weight, yields and profitability.
To learn more, download our tech brief, "5 Keys to Successful Laser Processing of Ceramic Substrates."