"While manufacturers can continue to place their large volume orders for raw materials from suppliers such as Kyocera®, CoorsTek®, and Ceramtec®, they can set up stocking plans with Accumet for the same material to provide faster delivery of uniquely processed runs to keep up with their various research and development and manufacturing requirements.” said Greg Sexton, CEO of Accumet. "Unlike the major suppliers, we’ll ship orders as small 10 pieces completely lapped, polished, cut, or drilled any way they like. And they’ll never have to worry about material not being available or having to make a large minimum buy.”
We routinely stock, and offer value-added materials consulting services, on these common
- Alumina 96%
- Alumina +99%
- Beryllium Oxide, BeO
- Aluminum Nitride, AlN
- Fused Silica
- Tungsten Carbide
Other materials in stock include adhesives and tapes for medical devices, frozen epoxy preforms, RF and EMI absorbers, metals and foils, Teflon, and various plastics and fabrics.
The reason alumina +99% is a common choice for microelectronics, is that it offers a superior surface for fabricating thin-film circuitry. When high-heat conductivity is required, designers often choose beryllium oxide (BeO). (BeO is costlier and is falling out of favor due to being less friendly to the environment but is still employed routinely. Accumet remains one of a few suppliers who stock and process it). Alternatively, aluminum nitride (AlN)—which offers slightly less heat conductivity than BeO—is much easier to gain approval of. Plus, it’s simple to handle, and provides medium-grade performance attributes that meet the requirements of many applications.
In addition to your main substrate material, we recommend you take into consideration your surface or embedded material choices as well. These materials can complicate fabrication, adding unplanned processing time and expense. Surface metals, for example, tend to reflect laser energy and can possibly cause slight changes in a laser’s kerf, if/when you laser process your completed circuits. The laser can also cause the metals on the backside of the substrate to melt, meld and bead. Glass also tends to chip when laser cut, especially on the exit side of the laser beam. And polymers may melt when the laser beam gets within 0.005 of them.
Download our latest tech brief "Selecting the Right Substrate Materials for High Power Electronics", published by our technical services team, to learn more on this subject.