Laser Drilling & Machining

Special Processing Removes Slag

If required, Accumet can provide customers with close tolerance, laser drilled or laser machined thick film, thin film, or as-fired substrates. This eliminates the need to purchase substrates from one source, and have them laser processed by another. Substrates can be laser drilled, scribed, or cut to customer specification. Typical of the attainable laser maxchining tolerances – hole diameter as small as .005” can be drilled with diametrical tolerances as close as +/-0.001”.

Of particular significance, Accumet laps/polishes substrates again after laser machining to eliminate all surface slag and laser hole entrance/exit slag (upon request). Loose slag on the interior hole is also reduced during the lapping/polishing operations. The extra manufacturing steps taken by Accumet ensures you the user, better adhesion and higher circuit yields.